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We use a laser energy pulse which attaches the solder spheres individually to the pad in less than 20m/s. The bonding of the sphere to pad in this short time does not allow heat dissipation into the silicon die, therefore offering a safe alternative to mass reflow.

Using automated processes, damaged leads on surface mount devices are re-aligned to the component manufacturer’s specification for SMT placement tolerances. We use the IC manufacturers mechanical data to programme our equipment and this information is then stored in the data files.